ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:ym2612

YM2612

General Info
Package DIP
Die size 1) 5,17 mm x 5,85 mm
Die Markings 2612-7
1988
(M) YAMAHA
Process 1P1M (Al)

Related devices:

  • Mega Drive / Genesis

1)
w/o scribe line