skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
YGR019B
chips:ygr019b
en
fr
YGR019B
General Info
Package
QFP
Die size
1)
5,85 mm x 5,84 mm
Die Markings
YGR019B
(M) HITACHI
Process
1P2M (Al)
Related devices:
Saturn
1)
w/o scribe line
Page Tools
Back to top