ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:sfb-hamp

SFB-HAMP

General Info
Package DIP
Die size 1) 0,83 mm x 1,08 mm
Die Markings SBM12
Process 1M (Al)

Related devices:

  • Super Scope (Super Nintendo)

1)
w/o scribe line