ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:sc430929pb

SC430929PB

General Info
Package QFP
Die size 1) 4,01 mm x 3,55 mm
Die Markings MC68HC05G6 G63C

MOT,INC.
(C) 1995 (M)
Process 1P1M (Al)

Related devices:

  • PlayStation

1)
w/o scribe line