skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
SA1
chips:sa1
en
fr
SA1
General Info
Package
QFP
Die size
1)
5,88 mm x 5,58 mm
Die Markings
1994
RICOH (C)
C5A123 (M)
Process
1P2M (Al)
Related devices:
Super Nintendo games
1)
w/o scribe line
Page Tools
Back to top