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S-PPU2 B
chips:s-ppu2_b
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S-PPU2 B
General Info
Package
QFP
Die size
1)
5,65 mm x 5,18 mm
Die Markings
G5C78-03
RICOH
(M) (C)
Process
1P2M (Al)
Related devices:
Super Nintendo
1)
w/o scribe line
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