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Semiconductor analysis and reverse engineering

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chips:rtc_p-dol_a

RTC P-DOL A

General Info
Package SOP
Die size 1) 6,49 mm x 2,20 mm
Die Markings 5108

(C) MXIC (M)
1999 5108
Process 1P1M (Al)

Related devices:

  • GameCube

1)
w/o scribe line