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chips:rcp-nus

RCP-NUS

General Info
Package QFP
Die size 1) 9,76 mm x 8,17 mm
Die Markings Nintendo Co., Ltd.
(C) Silicon Graphics,Inc.
(M) 1995 All Rights Reserved
RCP Rev.2.0 A

82001
(M) NEC
Process 1P3M (Al)

Related devices:

  • Nintendo 64

1)
w/o scribe line