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Semiconductor analysis and reverse engineering
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PIF(P)-NUS
chips:pif_p_-nus
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PIF(P)-NUS
General Info
Package
SOP
Die size
1)
4,23 mm x 3,75 mm
Die Markings
CECRNB
Process
1P1M (Al)
Related devices:
Nintendo 64
1)
w/o scribe line
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