ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:pic16lc63a

PIC16LC63A

General Info
Package SOP
Die size 1) 3,77 mm x 3,02 mm
Die Markings MICROCHIP
(M) (C)
A7AV2
Process 1P2M (Al)

Related devices:

  • Xbox

1)
w/o scribe line