ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:neo-zmc2

NEO-ZMC2

General Info
Package QFP
Die size 1) 4,41 mm x 4,28 mm
Die Markings 623438
2C33
FUJITSU
(C) 1987
Process 1P2M (Al)

Related devices:

  • Neo-Geo MVS

1)
w/o scribe line