skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
NEO-C1
chips:neo-c1
en
fr
NEO-C1
General Info
Package
QFP
Die size
1)
4,88 mm x 4,92 mm
Die Markings
622905U
2C34
FUJITSU
(C) 1987
Process
1P2M (Al)
Related devices:
Neo-Geo MVS
1)
w/o scribe line
Page Tools
Back to top