skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
MN864709
chips:mn864709
en
fr
MN864709
General Info
Package
QFP
Die size
1)
2,53 mm x 2,52 mm
Die Markings
MN864709
Process
1P7M (Cu) + 1TM (Al)
Related devices:
PlayStation 3
1)
w/o scribe line
Page Tools
Back to top