skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
MN662724RPE
chips:mn662724rpe
en
fr
MN662724RPE
General Info
Package
QFP
Die size
1)
6,10 mm x 5,72 mm
Die Markings
MN662724RPE-0
Process
1P2M (Al)
Related devices:
Saturn
1)
w/o scribe line
Page Tools
Back to top