skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
MC68000P8
chips:mc68000p8
en
fr
MC68000P8
General Info
Package
DIP
Die size
1)
5,65 mm x 4,97 mm
Die Markings
(C) 1979 (M)
MC68000
Process
1P1M (Al)
Related devices:
Mega Drive / Genesis
1)
w/o scribe line
Page Tools
Back to top