ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:mc68000p8

MC68000P8

General Info
Package DIP
Die size 1) 5,65 mm x 4,97 mm
Die Markings (C) 1979 (M)
MC68000
Process 1P1M (Al)

Related devices:

  • Mega Drive / Genesis

1)
w/o scribe line