ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:lspc2-a2

LSPC2-A2

General Info
Package QFP
Die size 1) 8,99 mm x 8,92 mm
Die Markings 2C54
CG10103-112

FUJITSU
(M) (C) 1989
Process 1P2M (Al)

Related devices:

  • Neo-Geo MVS

1)
w/o scribe line