ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:lc7883km

LC7883KM

General Info
Package SOP
Die size 1) 7,40 mm x 5,29 mm
Die Markings SANYO
5AC7883
Process 1P2M (Al)

Related devices:

  • Mega-CD 2 / Sega CD 2

1)
w/o scribe line