skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
ICS1893AF
chips:ics1893af
en
fr
ICS1893AF
General Info
Package
SOP
Die size
1)
2,81 mm x 2,49 mm
Die Markings
(M) ICS
3073U
Process
1P3M (Al)
Related devices:
Xbox
1)
w/o scribe line
Page Tools
Back to top