ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » HD6437097F
chips:hd6437097f

HD6437097F

General Info
Package QFP
Die size 1) 6,97 mm x 7,70 mm
Die Markings (M) 1994 Hitachi,Ltd. HD6437034S
Process 1P2M (Al)

Related devices:

  • Saturn

1)
w/o scribe line