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Semiconductor analysis and reverse engineering

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chips:gpu_x02056-010

GPU X02056-010

General Info
Package Flip chip BGA
Die size 1) 13,07 mm x 13,35 mm
9,48 x 7,23 mm
Die Markings (C) ATI
(M) 2005
XBOX
MICROSOFT (M)

NEC Electronics
XBOX
MICROSOFT (M)
X02041-003
Process 1P9M (Cu) + 1TM (Al)
low-k
1P7M (Cu)

Related devices:

  • Xbox 360

1)
w/o scribe line