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Semiconductor analysis and reverse engineering
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GC2-D3
chips:gc2-d3
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GC2-D3
General Info
Package
QFP
Die size
1)
2,45 mm x 2,38 mm
Die Markings
MN677206
Process
1P6M (Cu) + 1TM (Al)
Related devices:
Wii
1)
w/o scribe line
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