ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » F413
chips:f413

F413

General Info
Package SOP
Die size 1) 2,37 mm x 2,32 mm
Die Markings KLN4F6
Process 1P1M (Al)

Related devices:

  • Super Nintendo

1)
w/o scribe line