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Semiconductor analysis and reverse engineering
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DENC-NUS
chips:denc-nus
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DENC-NUS
General Info
Package
SOP
Die size
1)
4,53 mm x 3,27 mm
Die Markings
RICOH (C) (M)
A5C282
Process
1P2M (Al)
Related devices:
Nintendo 64
1)
w/o scribe line
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