skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
CXD9615GB
chips:cxd9615gb
en
fr
CXD9615GB
General Info
Package
BGA
Die size
1)
10,57 mm x 10,46 mm
Die Markings
TOSHIBA 東芝 (C) (M)
T5V60 1999
Process
1P4M (Al)
Related devices:
PlayStation 2
1)
w/o scribe line
Page Tools
Back to top