skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
CXD2991GB
chips:cxd2991gb
en
fr
CXD2991GB
General Info
Package
Flip chip BGA
Die size
1)
14,97 mm x 12,62 mm
9,05 mm x 8,14 mm (x4)
Die Markings
-
SAMSUNG K4J52324QE (x4)
Process
1P9M (Cu) + 1TM (Al)
low-k
Related devices:
PlayStation 3
1)
w/o scribe line
Page Tools
Back to top