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chips:cxd2991gb

CXD2991GB

General Info
Package Flip chip BGA
Die size 1) 14,97 mm x 12,62 mm
9,05 mm x 8,14 mm (x4)
Die Markings -

SAMSUNG K4J52324QE (x4)
Process 1P9M (Cu) + 1TM (Al)
low-k

Related devices:

  • PlayStation 3

1)
w/o scribe line