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CXD2990GB
chips:cxd2990gb
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CXD2990GB
General Info
Package
Flip chip BGA
Die size
1)
15,63 mm x 11,23 mm
Die Markings
(C) IBM 2006 39✕6736
SMAUG 43E6795
Process
SOI 1P10M (Cu) + 1TM (Al)
Related devices:
PlayStation 3
1)
w/o scribe line
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