ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » CXD2990GB
chips:cxd2990gb

CXD2990GB

General Info
Package Flip chip BGA
Die size 1) 15,63 mm x 11,23 mm
Die Markings (C) IBM 2006 39✕6736
SMAUG 43E6795
Process SOI 1P10M (Cu) + 1TM (Al)

Related devices:

  • PlayStation 3

1)
w/o scribe line