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chips:cxd2962bgg

CXD2962BGG

General Info
Package BGA
Die size 1) 9,06 mm x 9,04 mm
Die Markings (M) (C) SONY'04
D2962B
Process 1P7M (Cu) + 1TM (Al)

Related devices:

  • PlayStation Portable

1)
w/o scribe line