ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » CXD2545Q
chips:cxd2545q

CXD2545Q

General Info
Package QFP
Die size 1) 6,57 mm x 6,55 mm
Die Markings D2545
(M) (C) SONY'94
Process 1P2M (Al)

Related devices:

  • PlayStation

1)
w/o scribe line