ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » CXD1876
chips:cxd1876

CXD1876

General Info
Package BGA
Die size 1) 8,63 mm x 6,09 mm
5,97 mm x 3,21 mm
1,58 mm x 1,52 mm
Die Markings (M)(C) SONY'04
D1876

SAMSUNG (C)(M)
K4S641632H-9XX

BG521
60D
Process 1P5M (Al)

Related devices:

  • PlayStation Portable

1)
w/o scribe line