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CXD1876
chips:cxd1876
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CXD1876
General Info
Package
BGA
Die size
1)
8,63 mm x 6,09 mm
5,97 mm x 3,21 mm
1,58 mm x 1,52 mm
Die Markings
(M)(C) SONY'04
D1876
SAMSUNG (C)(M)
K4S641632H-9XX
BG521
60D
Process
1P5M (Al)
Related devices:
PlayStation Portable
1)
w/o scribe line
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