ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:cxa1145p

CXA1145P

General Info
Package DIP
Die size 1) 2,73 mm x 2,29 mm
Die Markings SONY
A1145
Process 2M (Al) + RDL (Al)

Related devices:

  • Mega Drive / Genesis

1)
w/o scribe line