skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
CX25871-14
chips:cx25871-14
en
fr
CX25871-14
General Info
Package
QFP
Die size
1)
5,11 mm x 5,02 mm
Die Markings
CONEXANT
(C)(M)1999
25871
Process
1P4M (Al)
Related devices:
Xbox
1)
w/o scribe line
Page Tools
Back to top