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Semiconductor analysis and reverse engineering

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chips:cpu-nus_a

CPU-NUS A

General Info
Package QFP
Die size 1) 8,65 mm x 5,04 mm
Die Markings R4300-2.3

(C) MIPS Technologies, Inc.
(M) 1995 All Rights Reserved

D9040
(M) 1994 NEC
Process 1P3M (Al)

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w/o scribe line