ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » AMP-NUS
chips:amp-nus

AMP-NUS

General Info
Package SOP
Die size 1) 3,00 mm x 1,85 mm
Die Markings BA R285 1
Process 1M (Al)

Related devices:

  • Nintendo 64

1)
w/o scribe line