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chips:88ap1-bjd2

88AP1-BJD2

General Info
Package BGA
Die size 1) 4,42 mm x 3,88 mm
Die Markings 198
(M) (C) 2009
MARVELL
Process 1P6M (Cu) + 1TM (Al)

Related devices:

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1)
w/o scribe line