skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
75006G631
chips:75006g631
en
fr
75006G631
General Info
Package
QFP
Die size
1)
5,33 mm x 4,30 mm
Die Markings
(M) NEC
D75006
Process
1P1M (Al)
Related devices:
Mega-CD 2 / Sega CD 2
1)
w/o scribe line
Page Tools
Back to top