ICReversing

Semiconductor analysis and reverse engineering

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chips:315-6208-02

315-6208-02

General Info
Package QFP
Die size 1) 7,43 mm x 7,00 mm
Die Markings 1C86F87 16A
Process 1P2M (Al)

Related devices:

  • VMU (Dreamcast)

1)
w/o scribe line