skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
315-6208-02
chips:315-6208-02
en
fr
315-6208-02
General Info
Package
QFP
Die size
1)
7,43 mm x 7,00 mm
Die Markings
1C86F87 16A
Process
1P2M (Al)
Related devices:
VMU (Dreamcast)
1)
w/o scribe line
Page Tools
Back to top