skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
315-5883
chips:315-5883
en
fr
315-5883
General Info
Package
QFP
Die size
1)
7,03 mm x 7,02 mm
Die Markings
HD64440S Hitachi,Ltd. (M) HD64440S
Process
1P2M (Al)
Related devices:
Saturn
1)
w/o scribe line
Page Tools
Back to top