skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
315-5805
chips:315-5805
en
fr
315-5805
General Info
Package
QFP
Die size
1)
3,63 mm x 3,62 mm
Die Markings
(M) NEC
65622-179
Process
1P2M (Al)
Related devices:
32X
1)
w/o scribe line
Page Tools
Back to top