ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » 315-5788
chips:315-5788

315-5788

General Info
Package SOP
Die size 1) 2,80 mm x 2,02 mm
Die Markings TC187
Process 2M (Al)

Related devices:

  • 32X

1)
w/o scribe line