ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:315-5781a

315-5781A

General Info
Package QFP
Die size 1) 5,37 mm x 5,35 mm
Die Markings NEC
D95147
Process 1P2M (Al)

Related devices:

  • 32X

1)
w/o scribe line