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Semiconductor analysis and reverse engineering

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chips:315-5750

315-5750

General Info
Package QFP
Die size 1) 7,93 mm x 7,62 mm
Die Markings (C) (M) 1994
SAMSUNG ELECTRONICS
SEGA160FSX
Process 1P2M (Al)

Related devices:

  • Virtua Racing (Mega Drive / Genesis game)

1)
w/o scribe line