skip to content
ICReversing
Semiconductor analysis and reverse engineering
User Tools
Log In
Site Tools
Search
Tools
Log In
>
You are here:
Home
»
Integrated circuits Library
»
315-5709
chips:315-5709
en
fr
315-5709
General Info
Package
QFP
Die size
1)
3,00 mm x 3,00 mm
Die Markings
(M) NEC
65612-065
Process
1P2M (Al)
Related devices:
Super Street Fighter II (Mega Drive / Genesis game)
1)
w/o scribe line
Page Tools
Back to top