ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:315-5709

315-5709

General Info
Package QFP
Die size 1) 3,00 mm x 3,00 mm
Die Markings (M) NEC
65612-065
Process 1P2M (Al)

Related devices:

  • Super Street Fighter II (Mega Drive / Genesis game)

1)
w/o scribe line