ICReversing

Semiconductor analysis and reverse engineering

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chips:315-5632

315-5632

General Info
Package QFP
Die size 1) 7,95 mm x 7,94 mm
Die Markings CY14
CE31501-020
FUJITSU
(C) 1992
Process 1P2M (Al)

Related devices:

  • Mega-CD 2 / Sega CD 2

1)
w/o scribe line