ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools

You are here: Home » Integrated circuits Library » 315-5632
chips:315-5632

315-5632

General Info
Package QFP
Die size 1) 7,95 mm x 7,94 mm
Die Markings CY14
CE31501-020
FUJITSU
(C) 1992
Process 1P2M (Al)

Related devices:

  • Mega-CD 2 / Sega CD 2

1)
w/o scribe line