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Semiconductor analysis and reverse engineering

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chips:315-5476a

315-5476A

General Info
Package QFP
Die size 1) 5,49 mm x 4,85 mm
Die Markings SEGA 5476
Process 1P2M (Al)

Related devices:

  • Mega-CD 2 / Sega CD 2

1)
w/o scribe line