ICReversing

Semiconductor analysis and reverse engineering

User Tools

Site Tools


chips:315-5433

315-5433

General Info
Package QFP
Die size 1) 7,26 mm x 7,27 mm
Die Markings NEC
92271-001
Process 1P2M (Al)

Related devices:

  • Mega Drive / Genesis

1)
w/o scribe line