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Semiconductor analysis and reverse engineering

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chips:315-5330

315-5330

General Info
Package DIP
Die size 1) 3,59 mm x 2,91 mm
Die Markings 675440
(C) 1985
FUJITSU 2C11
Process 1P2M (Al)

Related devices:

  • Master System

1)
w/o scribe line